Copper as an alternative antimicrobial coating for implants - An in vitro study

Figure 2 Copper release in Dulbecco’s modified Eagle medium. A high amount of copper is released from the TiCuN layer after incubation in DMEM for 24 h. The copper release is reduced on TiCuN + BONIT^® due to the BONIT^® layer. A complete exchange of the medium and seeding with MG-63 cells for another 24 h reveals significantly reduced copper release from TiCuN. The amount is equalized to the level on TiCuN + BONIT^® (n = 3, mean value ± SD, t-test, ^bP < 0.01). TPS: Titanium plasma spray; TiCuN: Titanium-copper-nitride; DMEM: Dulbecco’s modified Eagle medium.